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VD-6200 Rework Station
VD-6200 Rework Station
VD-6200 Rework Station
VD-6200 Rework Station
VD-6200 Rework Station
VD-6200 Rework Station
VD-6200 Rework Station
VD-6200 Rework Station
VD-6200 Rework Station
VD-6200 Rework Station
VD-6200 Rework Station
VD-6200 Rework Station

VD-6200 Rework Station

MOQ : 1 Unit

VD-6200 Rework Station Specification

  • Heater Type
  • Ceramic Heating Element
  • Voltage
  • 220V AC 10% 50Hz
  • Power
  • 700W
  • Temperature Range
  • 100C - 480C
  • Heat Up Time
  • Approx. 10 sec
  • Power Supply
  • AC Power
  • Cable Length
  • 1.5 meters
  • Material
  • ABS Body with Metal Stand
  • Air Flow
  • 120 L/min (Max)
  • Accessories
  • Standard Nozzle Set, Power Cord, User Manual
  • Weight
  • 3.2 kg
  • Usage & Applications
  • SMD Rework, BGA Repair, PCB Component Soldering & Desoldering
  • Control Type
  • Microprocessor Controlled
  • Size
  • 245 x 187 x 135 mm
  • Automation Grade
  • Semi-Automatic
  • Display
  • Digital LED
  • Storage Temperature
  • -20C to 80C
  • System Type
  • 2-in-1 Hot Air & Soldering Station
  • Package Includes
  • Rework Station, Stand, 3 Nozzles, User Guide, Power Cable
  • Tip to Ground Potential
  • <2mV
  • Safety Features
  • Overheat Protection, ESD Safe Design
  • Noise Level
  • <45 dB (A)
  • Cooling Mode
  • Automatic Cool Down Function
  • Operating Humidity
  • 35% - 85% RH
  • Nozzle Types
  • Compatible with Multiple Nozzle Sizes
  • Tip to Ground Resistance
  • <2
 

VD-6200 Rework Station Trade Information

  • Minimum Order Quantity
  • 1 Unit
  • Payment Terms
  • Cash in Advance (CID)
  • Supply Ability
  • 50 Units Per Month
  • Delivery Time
  • 2-10 Days
  • Main Domestic Market
  • All India
 

VD-6200 Rework Station About

Product Description

The VD-6200 Rework Station is a high-performance, precision system designed specifically for reworking Ball Grid Array (BGA), Chip Scale Package (CSP), and other Surface-Mount Device (SMD) components on printed circuit boards. It is suited for both production and repair environments that require excellent accuracy, control and repeatability.

Key features include:

  • Optical camera alignment module enabling precise alignment of the component (chip) and PCB tracks helping to ensure high-quality solder joints. 

  • A three-zone heating system: top hot-air, bottom hot-air, and bottom infrared (IR) heating to provide even temperature distribution and minimise PCB warping or damage. 

  • High precision positioning mechanism with adjustable X, Y, Z axes and a V-groove fixture for mounting. 

  • A touchscreen interface controlled via a PLC (Mitsubishi in one case) for easy programming and monitoring of temperature profiles, heating zones and alignment. 

  • Designed for repairing complex assemblies: both large PCBs and very small chips thanks to fine alignment and high-precision optics. 

The VD6200 is therefore built to deliver: outstanding solder joint reliability, reduced rework time, and improved yield in high-value electronics manufacturing and repair operations.



Efficient Dual-Mode Operation

The VD-6200 serves both as a hot air rework device and a precision soldering station, making it ideal for SMD and BGA component assembly or repair. Its microprocessor control ensures accurate adjustments while the digital LED display provides clear, real-time feedback for precise operation.


Versatile Nozzle Compatibility

Engineered for flexibility, this station comes with three interchangeable nozzles and accommodates a broad range of nozzle sizes. Users can seamlessly switch nozzles to meet varying requirements, whether working on delicate micro-components or larger parts, enhancing project versatility.


Reliable Safety and Stability

With built-in ESD-safe design and overheat protection, the VD-6200 safeguards not only your sensitive electronic components but also the longevity of your equipment. The automatic cool down function and robust insulation further contribute to safe handling and extended durability.

FAQ's of VD-6200 Rework Station:


Q: How does the automatic cool down function benefit the user?

A: The automatic cool down function ensures that the heating element and internal components gradually reduce in temperature after use. This feature helps prevent premature wear, increases the life span of the rework station, and improves safety by minimizing burn risks.

Q: What types of nozzles are supported, and how do I select the right one?

A: The VD-6200 is compatible with multiple nozzle sizes, making it suitable for various SMD and BGA rework tasks. You can select a nozzle size based on the component dimensions and the specific heating requirements detailed in your user guide.

Q: When should I use the rework station for PCB soldering and desoldering?

A: Utilize the VD-6200 for PCB soldering and desoldering whenever you need to remove or install surface-mounted components, perform BGA repairs, or handle sensitive parts that require precise temperature control and stable airflow.

Q: Where can this rework station be used and who can benefit from it?

A: This station is suitable for use in electronics manufacturing, repair workshops, and service centers. Dealers, exporters, fabricators, resellers, and technicians across India will find it valuable for high-efficiency SMD rework and PCB component repairs.

Q: What is the process for adjusting temperature and airflow on the VD-6200?

A: The VD-6200 features a microprocessor-controlled system, allowing users to adjust temperature (100C-480C) and airflow (up to 120 L/min) precisely via digital controls. The LED display shows current settings for easy, real-time adjustment.

Q: How does the ESD safe design and overheat protection enhance safety during usage?

A: The ESD safe design prevents electrostatic discharge, thus protecting sensitive electronic components. Overheat protection automatically cuts off the power if unsafe temperatures are detected, reducing the risk of damage and ensuring user safety.

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